RO4003C 2-Layer 16mil ENIG PCB for High-Frequency RF Applications
1.Introduction
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics with the electrical performance of PTFE/woven glass and the manufacturability of epoxy/glass. Offered in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles while meeting the same electrical performance specifications. These laminates provide tight control on dielectric constant (Dk) and low loss, and can be processed using standard epoxy/glass methods at a fraction of the cost of conventional microwave materials. Unlike PTFE-based substrates, no special through-hole treatments or handling procedures are required.
RO4003C materials are non-brominated and not UL 94 V-0 rated. The thermal coefficient of expansion (CTE) of RO4003C is similar to copper, ensuring excellent dimensional stability—critical for mixed dielectric multi-layer boards. The low Z-axis CTE provides reliable plated through-hole quality even under severe thermal shock conditions. With a Tg >280°C (536°F), RO4003C maintains stable expansion characteristics across all circuit processing temperatures.
2.Key Features
Dielectric Constant (Dk): 3.38 ±0.05 @ 10 GHz
Dissipation Factor: 0.0027 @ 10 GHz, 0.0021 @ 2.5 GHz
Thermal Coefficient of Dk: +40 ppm/°C
Thermal Conductivity: 0.71 W/m/°K
CTE: X: 11 ppm/°C, Y: 14 ppm/°C, Z: 46 ppm/°C
Moisture Absorption: 0.06%
Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Board Thickness: 0.5mm (16mil core)
3.Benefits
Ideal for multi-layer board (MLB) constructions
Processes like FR-4 at lower fabrication costs
Designed for performance-sensitive, high-volume applications
Competitively priced
4.PCB Construction Details
| Parameter | Specification | Notes |
|---|---|---|
| Base Material | RO4003C | |
| Layer Count | Double sided | |
| Board Dimensions | 38.8mm x 52.4mm | 1-PCS, +/-0.15mm tolerance |
| Min. Trace/Space | 5/5 mils | |
| Min. Hole Size | 0.2mm | |
| Blind/Buried Vias | No | |
| Finished Thickness | 0.5mm | |
| Finished Cu Weight | 1 oz (1.4 mils) | |
| Via Plating Thickness | 20 μm | |
| Surface Finish | Electroless Nickel Immersion Gold | ENIG |
| Top Silkscreen | Black | |
| Bottom Silkscreen | No | |
| Top Solder Mask | No | |
| Bottom Solder Mask | No | |
| Electrical Test | 100% tested | Prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 - 35 μm
Rogers 4003C Core - 0.406 mm (16mil)
Copper layer 2 - 35 μm
6.PCB Statistics:
Components: 6
Total Pads: 17
Thru Hole Pads: 11
Top SMT Pads: 6
Bottom SMT Pads: 0
Vias: 9
Nets: 2
7.Typical Applications
Cellular base station antennas and power amplifiers
RF identification tags
Automotive radar and sensors
LNBs for direct broadcast satellites
8.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support